Construction Track: Chip Design & Electronic Design Automation

Course Catalog & Credential Pathway — Dwg. No. PF-002F

Chip Design & Electronic Design Automation

Ed. 2026–27grades 9–12 + post-secondary

A field branch of the Construction Track, for students aimed at silicon itself — reinforcement learning applied to a floorplan instead of a game board.

Field branch of Dwg. No. PF-002, The Construction Track — same core sequence through Phase II, concentrated here into digital logic and physical layout from Phase II onward. See also Dwg. No. PF-001, The Verification Track.

Working premise: Google's AlphaChip used reinforcement learning to place and route chip floorplans for its own TPUs, and Cadence and NVIDIA have since pushed the same idea into commercial EDA tools aimed at full autonomous design flows. The model is proposing a floorplan in minutes that used to take a human layout engineer weeks — but it still has to satisfy timing closure and power constraints a layout engineer would recognize on sight.

Five core strands, plus the domain strand this branch concentrates in

MATH
Mathematical Foundations
Linear algebra, calculus, probability, optimization — the language every architecture is written in.
ENG
Software & Systems Engineering
Data structures, distributed computing, performance at scale.
ML
Machine Learning & Deep Learning
Architectures, training dynamics, why a model behaves the way it does.
RES
Research Practice
Reading a paper closely enough to rebuild what's inside it.
BLD
Build & Ship
Open-source contribution, deployment, production ML that survives contact with real load.
EDA
Chip Design & Electronic Design Automation
This branch's concentration — digital logic, VLSI layout, and RL-driven floorplanning.
Phase I

Foundations

Grades 9–10

No floorplans yet, and no logic gates yet either. Two years of straight math and programming fundamentals, identical to the core Construction Track.

CodeDescriptionStrandLoad
MATH 101

Precalculus, Accelerated

Compressed to clear room for calculus by grade 11 — the standard on-ramp for anyone headed toward a quantitative degree.

MATH
1.0 credit
CS 100

Programming I — Python

Variables, control flow, functions, data structures. Fluency, not tricks.

ENG
1.0 credit
MATH 110

Discrete Mathematics & Logic

Sets, proofs, graphs, combinatorics — the math CS theory actually runs on, usually skipped until it's overdue.

MATH
0.5 credit
ENG 105

Technical Writing for Research

Writing a clear methods section and an honest results section — the two paragraphs every paper lives or dies on.

RES
0.5 credit
Phase II

Applied Practice

Grades 11–12

The math and CS sequences converge into an actual first model, same as the core track. The hardware layer begins concurrently — by the end of Phase II a student can both train a small model and hand-route a digital circuit's timing closure.

CodeDescriptionStrandLoad
MATH 201

Calculus I & II

Through multivariable and the gradient — backpropagation is the chain rule with bookkeeping, and it should read that way.

MATH 101

MATH
1.5 credit
MATH 210

Linear Algebra

Vector spaces, eigendecomposition, matrix calculus. Every tensor operation is this course wearing a framework's syntax.

MATH 101

MATH
1.0 credit
STAT 220

Probability & Statistics for ML

Distributions, estimation, Bayes — framed toward loss functions and uncertainty, not toward the social-science stats track.

MATH
1.0 credit
CS 210

Data Structures & Algorithms

Complexity analysis and the standard structures, drilled to fluency — still the baseline technical-interview bar at every AI lab.

CS 100

ENG
1.0 credit
ML 230

Intro to Machine Learning

Regression through a first neural net, built from array operations before any framework is allowed to hide the mechanics.

MATH 210, STAT 220

ML
1.0 credit
RES 240

Research Seminar — Reading Group

Weekly seminal-paper reads (perceptron through transformers), presented and defended aloud, not just summarized.

RES
0.5 credit
ENG 225

Digital Logic & Computer Architecture

Combinational and sequential logic, pipelining, and the microarchitecture vocabulary underneath every chip a design tool is asked to lay out.

CS 210

EDA
1.0 credit
EDA 235

VLSI Design & Physical Layout

Floorplanning, placement, routing, and timing closure done by hand first — the ground truth a graduate needs before trusting an autonomous design tool's output.

ENG 225

EDA
1.0 credit
Phase III

Apprenticeship

Post-HS, Yrs 1–4

Here the domain degree takes over from the general CS/applied-math track. A computer engineering or electrical engineering-plus-CS program replaces DEG 300 — chip design employers hire for silicon fluency first.

CodeDescriptionStrandLoad
DEG 300

Computer / Electrical Engineering Degree

Formal core in a computer engineering or electrical engineering-plus-CS program — silicon fluency is what chip design employers hire for first.

EDA
variable
EDA 340

Reinforcement Learning for Chip Floorplanning

RL-based placement and routing in the AlphaChip tradition, plus the commercial autonomous-design tooling now shipping from major EDA vendors.

EDA 235, ML 230

EDA
1.5 credit
ML 310

Deep Reinforcement Learning

Policy gradients, value functions, and the RL methods behind systems like AlphaChip, taught directly against a floorplanning or routing benchmark rather than as a generic survey.

ML 230

ML
2.0 credit
ENG 320

Systems for ML

Distributed training, GPU/accelerator programming, and the infrastructure a large-scale floorplanning search needs to explore a design space at any real breadth.

CS 210

ENG
1.5 credit
RES 350

Supervised Research Practicum

Placement inside a semiconductor or EDA-tooling group, with a mentor of record. Graded on a reproduction that actually reproduces, or a contribution that gets merged.

RES 240, ML 310

RES / BLD
2 semesters
BLD 360

Capstone — Build & Ship

One model or tool — an RL-based placer, a floorplanning benchmark — taken from idea to a deployed, load-bearing artifact against a real layout problem.

ENG 320, RES 350

BLD
1.0 credit
Note: RES 350 and BLD 360 keep the same credit weight and sequencing as the core Construction Track — only the placement changes, into a semiconductor or EDA-tooling group specifically, shipping a capstone against a real layout problem.
Phase IV

Continuing Education

No end date: the ML baseline moves every conference cycle, and the fabrication-process baseline — node shrinks, new tool releases from Cadence, Synopsys, and NVIDIA — moves on its own industry schedule that a purely computational graduate can lose track of.

Read weekly Reproduce monthly Ship ongoing Publish on result
Weekly
Paper & tooling trackingFollow arXiv's cs.AR feed plus the Google, Cadence, and NVIDIA EDA-research blogs — one narrow feed read closely.
Monthly
Reproduction sprintReimplement one result from a tracked paper — an RL placer, a routing-congestion predictor. The one that won't reproduce is usually more instructive.
Ongoing
Ship something load-bearingKeep at least one deployed artifact — a layout-evaluation tool, a floorplanning benchmark — with real users.
On result
Publish or contributeA workshop paper, a blog writeup, or a merged PR against an open-source EDA or chip-design tool.
Drawing
PF‑002F
Pair
PF‑002 Construction
Edition
2026–27
Strands
MATH ENG ML RES BLD EDA